TSMC prepares to make fingerprint sensors for the next iPhone

It’s being reported by industry insiders today that Taiwan Semiconductor Manufacturing Company will begin production of fingerprint sensors for Apple’s next-generation iPhone at its 12-inch fab using a 65nm process in the second quarter of 2014. 

TSMC will start producing fingerprint sensors for the next-generation iPhone in the second quarter, industry sources claim. The supplier will reportedly use a 65nm process at its 12-inch fab, and also bring backend wafer-level chip scale packaging in-house, instead of subcontracting it. In-house packaging is expected to improve production yields; trouble with manufacturing fingerprint sensors is often believed to be the reason the iPhone 5s shipped in such low numbers last September. 

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