Next year’s smartphones could have 6GB of RAM thanks to Samsung

TECHi's Author Brian Molidor
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Last Updated Originally published September 9, 2015 · 1:20 PM EDT
Digitaltrends View all Digitaltrends Two Takes by TECHi Read the original story Published September 9, 2015 Updated January 30, 2024
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Brian Molidor
Brian Molidor
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Nowadays, most high-end mobile devices come with either 3GB or 4GB of RAM, but that number could jump up to 6GB in the near future thanks to Samsung. The company has started producing next-generation LPDDR4 modules for mobile devices that could bring 6GB of RAM to future smartphone, with as much as a 30% increase in performance over current-generation chips. On top of the performance increase, Samsung claims the chips are 20% more energy-efficient, which means faster performance AND longer battery life.  

Digitaltrends

Digitaltrends

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Samsung has announced the production of a new, high-speed, high-capacity memory module for mobile devices, which could see its future Galaxy smartphones come with up to 6GB of RAM inside. The new LPDDR4 module is a first for the mobile industry, and offers other benefits beyond the expected speed increase. In its top-spec form, the new memory module will add 6GB of RAM using four chips to a smartphone, and is up to 30-percent faster than the previous generation chip. It’s designed for use in “next generation” phones, according to Samsung, that run the very latest OS version — indicating the chip will be one part of the spec on Android Marshmallow phones. Aside from the performance increase, the chip uses 20-percent less power than the older modules, which will probably mean battery life remains constant compared to today’s phones — due to other spec increases elsewhere — rather than us seeing an increase. Interestingly, these four-chip modules take up the same space inside a device as the current 3GB setups, so there will be no need to compromise on design. Samsung has also produced a two-chip version which delivers 3GB of RAM, that could be used in mid-range devices.

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